G. Pitarresi: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

A review of the general theory of thermoelastic stress analysis

Pitarresi, G, Patterson, E A

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2003

Language:

english

File:

PDF, 196 KB

english, 2003

2

Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 855 KB

english, 2005

3

Evaluation of interlaminar delaminations in titanium-graphite fibre metal laminates by infrared NDT techniques

Montinaro, N., Cerniglia, D., Pitarresi, G.

Journal:

NDT & E International

Year:

2018

Language:

english

File:

PDF, 4.33 MB

english, 2018

4

Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

Iannuzzelli, R. J., Pitarresi, J. M., Prakash, V.

Journal:

Journal of Electronic Packaging

Year:

1996

Language:

english

File:

PDF, 768 KB

english, 1996

5

Analytical Solution for Electronic Assemblies Under Vibration

Gharaibeh, Mohammad A., Su, Quang T., Pitarresi, James M.

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 4.68 MB

english, 2016

6

Effect of voids on the reliability of BGA/CSP solder joints

Mohammad Yunus, K. Srihari, J.M. Pitarresi, Anthony Primavera

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 752 KB

english, 2003

7

Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method

Gharaibeh, Mohammad A., Pitarresi, James M.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.74 MB

english, 2019

8

Stress Analysis of Component Attachments to Printed Circuit Boards

Prakash, V., Engel, P.A., Pitarresi, J.M., Albert, T., Westby, G.

Journal:

Soldering & Surface Mount Technology

Year:

1992

Language:

english

File:

PDF, 327 KB

english, 1992

9

Optimal Design Procedures for Active Structures

Cha, J. Z., Pitarresi, J. M., Soong, T. T.

Journal:

Journal of Structural Engineering

Year:

1988

Language:

english

File:

PDF, 608 KB

english, 1988

10

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Applied Mechanics - Computationally Efficient Approaches to Simulate the Dynamics of Microbeams Under Mechanical Shock

Younis, Mohammad I., Jordy, Danial, Pitarresi, James M.

Year:

2006

Language:

english

File:

PDF, 443 KB

english, 2006

11

Analytical model for the transient analysis of electronic assemblies subjected to impact loading

Gharaibeh, Mohammad A., Su, Quang T., Pitarresi, James M.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.22 MB

english, 2018

12

A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards

Pitarresi, J. M., Di Edwardo, A. V.

Journal:

Journal of Electronic Packaging

Year:

1993

Language:

english

File:

PDF, 774 KB

english, 1993

13

Accelerated Vibration Reliability Testing of Electronic Assemblies using Sine Dwell with Resonance Tracking

Su, Quang T., Gharaibeh, Mohammad, Stewart, Aaron, Pitarresi, James, Anselm, Martin K.

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 2.04 MB

english, 2018

14

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Park, S. B., Shah, Chirag, Kwak, Jae B., Jang, Changsoo, Chung, Soonwan, Pitarresi, James M.

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 506 KB

english, 2008

15

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

Pitarresi, J. M., Primavera, A. A.

Journal:

Journal of Electronic Packaging

Year:

1992

Language:

english

File:

PDF, 738 KB

english, 1992

16

The “Smeared” Property Technique for the FE Vibration Analysis of Printed Circuit Cards

Pitarresi, J. M., Caletka, D. V., Caldwell, R., Smith, D. E.

Journal:

Journal of Electronic Packaging

Year:

1991

Language:

english

File:

PDF, 869 KB

english, 1991

17

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - A lamination study of a composite LCD flat panel display

Greenfield, P., Pitarresi, J., Lehmann, G., Skinner, D., Lee, J., Sammakia, B., Zou, J.

Year:

2002

Language:

english

File:

PDF, 634 KB

english, 2002

18

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling

Chaparala, S., Pitarresi, J. M., Meilunas, M.

Year:

2006

Language:

english

File:

PDF, 291 KB

english, 2006

19

Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock

Younis, Mohammad I., Jordy, Daniel, Pitarresi, James M.

Journal:

Journal of Microelectromechanical Systems

Year:

2007

Language:

english

File:

PDF, 562 KB

english, 2007

20

Nonlinear analysis using temporal finite elements

Slade Gellin, James M. Pitarresi

Journal:

Engineering Analysis

Year:

1988

Language:

english

File:

PDF, 512 KB

english, 1988

21

Photo-Cross-Linked Hydrogels with Polysaccharide−Poly(amino acid) Structure: New Biomaterials for Pharmaceutical Applications

Pitarresi, Giovanna, Pierro, Paola, Palumbo, Fabio S., Tripodo, Giuseppe, Giammona, Gaetano

Journal:

Biomacromolecules

Year:

2006

Language:

english

File:

PDF, 168 KB

english, 2006

22

Investigation on the Influence of the Surface Resin Rich Layer on the Thermoelastic Signal from Different Composite Laminate Lay-Ups

Pitarresi, G., Conti, A., Galietti, U.

Journal:

Applied Mechanics and Materials

Year:

2005

Language:

english

File:

PDF, 338 KB

english, 2005

23

In situ gel forming graft copolymers of a polyaspartamide and polylactic acid: Preparation and characterization

Giovanna Pitarresi, Fabio S. Palumbo, Antonella Albanese, Mariano Licciardi, Filippo Calascibetta, Gaetano Giammona

Journal:

European Polymer Journal

Year:

2008

Language:

english

File:

PDF, 663 KB

english, 2008

24

[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Mechanical modeling of tiled Liquid Crystal on Silicon (LCoS) microdisplay

Cuddalorepatta, G., Pitarresi, J.M., Sammakia, B.G.

Year:

2004

Language:

english

File:

PDF, 534 KB

english, 2004

25

Review of photoelastic image analysis applied to structural birefringent materials: glass and polymers

Scafidi, Michele, Pitarresi, Giuseppe, Toscano, Andrea, Petrucci, Giovanni, Alessi, Sabina, Ajovalasit, Augusto

Journal:

Optical Engineering

Year:

2015

Language:

english

File:

PDF, 2.33 MB

english, 2015

26

Investigation of the crack tip stress field in a stainless steel SENT specimen by means of Thermoelastic Stress Analysis

Pitarresi, Giuseppe, Ricotta, Mauro, Meneghetti, Giovanni

Journal:

Procedia Structural Integrity

Year:

2019

Language:

english

File:

PDF, 5.52 MB

english, 2019

27

Mechanical Behaviour of a Green Sandwich Made of Flax Reinforced Polymer Facings and Cork Core

Mancuso, Antonio, Pitarresi, Giuseppe, Tumino, Davide

Journal:

Procedia Engineering

Year:

2015

File:

PDF, 1.80 MB

2015

28

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Chaparala, S., Pitarresi, J. M., Parupalli, S., Mandepudi, S., Meilunas, M.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 948 KB

english, 2006

29

Using FEM simulation to predict structural performances of a sailing dinghy

Mancuso, A., Pitarresi, G., Tumino, D.

Journal:

International Journal on Interactive Design and Manufacturing (IJIDeM)

Year:

2017

Language:

english

File:

PDF, 3.12 MB

english, 2017

30

Ferulic acid inhibits oxidative stress and cell death induced by Ab oligomers: Improved delivery by solid lipid nanoparticles

Picone, Pasquale, Bondi, Maria L., Picone, Pasquale, Bondi, Maria L., Montana, Giovanna, Bruno, Andreina, Pitarresi, Giovanna, Giammona, Gaetano, Di Carlo, Marta

Journal:

Free Radical Research

Year:

2009

Language:

english

File:

PDF, 654 KB

english, 2009

31

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Wrinkling of Thin Membrane Under Thermal Loading

Gao, Jia, Park, Seungbae, Pitarresi, James, Homentcovschi, Dorel

Year:

2006

Language:

english

File:

PDF, 704 KB

english, 2006

32

Thermoelastic stress analysis by means of an infrared scanner and a two-dimensional fast Fourier transform-based lock-in technique

Pitarresi, G, D'Acquisto, L, Siddiolo, A M

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2008

Language:

english

File:

PDF, 715 KB

english, 2008

33

Resveratrol depletes mitochondrial DNA and inhibition of autophagy enhances resveratrol-induced caspase activation

Prabhu, Varun, Srivastava, Pragya, Yadav, Neelu, Amadori, Michael, Schneider, Andrea, Seshadri, Athul, Pitarresi, Jason, Scott, Rachael, Zhang, Honghao, Koochekpour, Shahriar, Gogada, Raghu, Chandra,

Journal:

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013

34

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparison of joint level impact fatigue resistance and board level drop test

Guruprasad, Pradosh, Pitarresi, James

Year:

2009

Language:

english

File:

PDF, 1.10 MB

english, 2009

35

EMT, MET, Plasticity, and Tumor Metastasis

Bakir, Basil, Chiarella, Anna M., Pitarresi, Jason R., Rustgi, Anil K.

Journal:

Trends in Cell Biology

Year:

2020

File:

PDF, 1015 KB

2020

36

A methodology for the rapid characterization of Mode II delamination fatigue threshold in FRP composites

Pitarresi, Giuseppe, Scalici, Tommaso, Dellaira, Marco, Catalanotti, Giuseppe

Journal:

Engineering Fracture Mechanics

Year:

2019

Language:

english

File:

PDF, 1.15 MB

english, 2019

37

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Assessment of PCB pad cratering resistance by joint level testing

Roggeman, Brian, Borgesen, Peter, Li, Jing, Godbole, Guarav, Tumne, Pushkraj, Srihari, K., Levo, Tim, Pitarresi, James

Year:

2008

Language:

english

File:

PDF, 956 KB

english, 2008

38

Mechanical properties of basalt fiber reinforced composites manufactured with different vacuum assisted impregnation techniques

Scalici, T., Pitarresi, G., Badagliacco, D., Fiore, V., Valenza, A.

Journal:

Composites Part B: Engineering

Year:

2016

Language:

english

File:

PDF, 16.30 MB

english, 2016

39

[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Structural optimization of an electrical spring contact

Macek, T., Pitarresi, J.M.

Year:

1993

Language:

english

File:

PDF, 769 KB

english, 1993

40

On the history of torsional stress concentrations in shafts: From electrical analogies to numerical methods

Ajovalasit, A., Nigrelli, V., Pitarresi, G., Virzi Mariotti, G.

Journal:

Journal of Strain Analysis for Engineering Design

Year:

2014

Language:

english

File:

PDF, 2.90 MB

english, 2014

41

In-situ forming gel-like depot of a polyaspartamide-polylactide copolymer for once a week administration of sulpiride

Fiorica, Calogero, Palumbo, Fabio Salvatore, Pitarresi, Giovanna, Giorgi, Mario, Calascibetta, Filippo, Giammona, Gaetano

Journal:

Journal of Pharmacy and Pharmacology

Year:

2015

Language:

english

File:

PDF, 692 KB

english, 2015

42

Synthesis and evaluation of thermo-rheological behaviour and ionotropic crosslinking of new gellan gum-alkyl derivatives

Agnello, Stefano, Palumbo, Fabio Salvatore, Pitarresi, Giovanna, Fiorica, Calogero, Giammona, Gaetano

Journal:

Carbohydrate Polymers

Year:

2018

Language:

english

File:

PDF, 1.66 MB

english, 2018

43

A Numerical Study on Interlaminar Defects Characterization in Fibre Metal Laminates with Flying Laser Spot Thermography

Montinaro, N., Cerniglia, D., Pitarresi, G.

Journal:

Journal of Nondestructive Evaluation

Year:

2018

Language:

english

File:

PDF, 1.40 MB

english, 2018

44

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Response of an electrostatically actuated microbeam to drop-table test

Ouakad, H., Younis, M. I., Alsaleem., F., Levo, T., Pitarresi, J.

Year:

2010

Language:

english

File:

PDF, 7.67 MB

english, 2010

45

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Impact of board configuration and shock loading conditions for board level drop test

Guruprasad, Pradosh, Roggeman, Brian, Pitarresi, James

Year:

2011

Language:

english

File:

PDF, 1.78 MB

english, 2011

46

Thermal NDE of thick GRP panels by means of a Pulse Modulated Lock-In Thermography technique

Journal:

EPJ Web of Conferences

Year:

2010

Language:

english

File:

PDF, 902 KB

english, 2010

47

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of temperature on transition in failure modes for high speed impact test of solder joint and comparison with board level drop test

Guruprasad, Pradosh, Pitarresi, James

Year:

2010

Language:

english

File:

PDF, 2.94 MB

english, 2010

48

Mechanical characterization of polysaccharide/polyaminoacid hydrogels as potential scaffolds for tissue regeneration

Pietro Matricardi, Giovanna Pitarresi, Fabio Salvatore Palumbo, Chiara Di Meo, Antonella Albanese, Tommasina Coviello, Claudia Cencetti, Calogero Fiorica, Gaetano Giammona

Journal:

Macromolecular Research

Year:

2011

Language:

english

File:

PDF, 382 KB

english, 2011

49

The future use of structural composite materials in the automotive industry

Mangino, Enrico, Carruthers, Joe, Pitarresi, Giuseppe

Journal:

International Journal of Vehicle Design

Year:

2007

Language:

english

File:

PDF, 474 KB

english, 2007

50

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact

Park, Seungbae, Shah, Chirag, Kwak, Jae, Jang, Changsoo, Pitarresi, James, Park, Taesang, Jang, Seyoung

Year:

2007

Language:

english

File:

PDF, 6.04 MB

english, 2007

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски